Engineered Materials Systems Introduces Room Temperature Cure Conductive Adhesive for General Assembly Applications
DELAWARE, OHIO – April 2015 – Engineered Materials Systems, a leading global supplier of conductive interconnect materials for circuit assembly applications, announces the introduction of its new EMS 618-15 Adhesive. The room temperature cure two-part conductive adhesive has been designed for circuit assembly applications.
EMS 618-15 is designed to cure in 24-hours at room temperature or rapidly at elevated temperatures. The material has a ten-to-one mix ratio and is available in a two syringe packaging system designed for use with static mix heads. EMS 618-15 forms high strength, high reliability conductive interconnects.
The EMS 618-15 conductive adhesive is the latest addition to Engineered Conductive Materials’ full line of conductive adhesives for circuit assembly applications.
For more information about the EMS 618-15 Room Temperature Cure Conductive Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.