DEK and SIPLACE showcased Industry 4.0 Smart-factory solutions at Nepcon Shanghai

Technology leader ASM Assembly Systems explicitly puts its presence at Nepcon Shanghai (April 21-23, 2015) under the motto of Industry 4.0. At booth
C-1H01, the company will exhibit the powerful printing and placement platforms of its DEK and SIPLACE brands, and a large section of the booth will show a “smart factory”. At various stations for smart planning, smart NPI, smart changeover and smart material logistics, ASM will show solutions that let users network, automate, support and control electronics manufacturing processes. ASM will further underscore its technological leadership position with topics like 0201 (metric) placement, flexible setup concepts, and chip assembly directly from the wafer. A high-speed line consisting of a DEK Gemini printer and a SIPLACE X4iS placement machine will demonstrate live what the global leader in placement performance has to offer. With its E by SIPLACE, ASM will also present at booth C-1G01 a newly developed solution for mid-speed applications that comes by default with features like placement force sensors and high-precision drives and sets new standards in quality and performance with innovations like combi-heads and a high-end digital vision system.

ASM has a clear roadmap to Industry 4.0 that helps electronics manufacturers around the world to turn their operations into smart SMT factories step-by-step.

ASM has a clear roadmap to Industry 4.0 that helps electronics manufacturers around the world to turn their operations into smart SMT factories step-by-step.

“Industry 4.0 is no abstract concept of the future for us, because we are already working on concrete implementations for today’s electronics production. In our Smart Factory section, visitors will see how electronics manufacturers can produce with significantly more speed, reliability and efficiency by networking their material flows with the SIPLACE Material Manager. And in areas dedicated to smart NPI, smart changeover and smart planning we will show how our experts are optimizing not just printing and placement, but all support processes for modern production lines. We have a clear roadmap to Industry 4.0 that helps us and our customers around the world to turn their operations into smart SMT factories step-by-step,” explains Günter Lauber, CEO of ASM Assembly Systems.

A large portion of the DEK and SIPLACE booth will be dedicated to the “smart SMT factory”. Various workstations will provide visitors with a look at fully networked electronics production. With the SIPLACE Material Manager, ASM will present a modular software solution for paperless workflows that makes the shop floor fully transparent and raises it to the level required for Industry 4.0 applications. Other new products like the SIPLACE Material Tower and the SIPLACE Active Feeder Rack are further examples of SIPLACE’s dedication to the Industry 4.0 concept. The SIPLACE Material Tower is an automated and MSD-capable component storage system that is fully integrated into the SIPLACE Material Manager. The compact cabinet holds up to 900 reels and optimizes the component supply process for lines and kitting areas in the smart factory. The SIPLACE Active Feeder Rack cuts down on trip frequencies and distances and reduces manual operations in logistics and setup processes. At the push of a button, operators can see which materials will still be needed by upcoming jobs or which feeders must be installed for the next setup. This saves on time, avoids mistakes and reduces material travel considerably.

Benchmarks in speed, accuracy and flexibility

Powerful DEK printers and SIPLACE placement platforms provide the basis for the smart SMT factory, which is why the booth will feature a high-speed line with a DEK Gemini printer and a SIPLACE S4iS placement machine. For more flexible production environments, a SIPLACE SX placement machine and a DEK Horizon 03iX printer will be shown.

Another highlight

An SMT line equipped with a DEK Gemini printer and SIPLACE X4i and SIPLACE X3 placement machines will demonstrate the placement of 0201 (metric) components, while process experts will explain to visitors the intricacies involved in the handling of these super-small components. In addition, advanced DEK technologies such as the area ratio rule-breaker ProActiv, VectorGuard High Tension stencils and high–performance understencil chemistries and fabrics will show how they support electronics manufacturers on their move to the smart SMT factory.

E by SIPLACE for mid-speed applications

With its E by SIPLACE, ASM is addressing the market for mid-speed applications. The new platform shines with outstanding specifications in terms of placement speed and quality. They are made possible by features that used to be unavailable in this segment: high-precision linear drives, flexible E-feeders, a high-end vision system, placement sensors even in the standard version, powerful high-speed heads, and innovative combi-heads that allow even a single-gantry machine to handle a broad spectrum of components in collect-and-place and pick-and-place mode.