ASM presents its total solutions from Back-end to SMT equipment at Internepcon Japan 2018
This January, ASM will be participating in the Internepcon Japan 2018 highlighting its total solutions from back-end equipment to SMT equipment.
As this is the first time ASM will be showcasing their wide range of total factory solutions together, the show would be a great opportunity for customers to find out more about the products. There will be exhibition of various platforms such as ASM Automatic Die Bonding System: AD210 and AD832i, ASM SMT high-end printing and placement platforms: DEK NeoHorizon iX and SIPLACE TX2i, and mid-speed placement platform: E by SIPLACE.
- Date: 17 – 19 January 2018 (Wed – Fri)
- Time: 10:00 – 18:00
- ASM Booth: Booth No. E12-48, Tokyo Big Sight